Invention Grant
- Patent Title: Powder atomic layer deposition equipment with quick release function
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Application No.: US17504270Application Date: 2021-10-18
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Publication No.: US11952662B2Publication Date: 2024-04-09
- Inventor: Jing-Cheng Lin , Jung-Hua Chang , Chia-Cheng Ku
- Applicant: SKY TECH INC.
- Applicant Address: TW Hsinchu County
- Assignee: SKY TECH INC.
- Current Assignee: SKY TECH INC.
- Current Assignee Address: TW Hsinchu County
- Agency: HDLS IPR SERVICES
- Agent Chun-Ming Shih
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/44 ; H01L33/00

Abstract:
Disclosed is a powder atomic layer deposition equipment with a quick release function, comprising a vacuum chamber, a shaft sealing device, and a driving unit connected to the shaft sealing device. The vacuum chamber is connected to the shaft sealing device, and an enclosed space is formed between the vacuum chamber and the shaft sealing device. At least one air extraction line is located in the shaft sealing device and fluidly connected to the enclosed space, the air extraction line being used in pumping gas out from the enclosed space to fix the vacuum chamber to the shaft sealing device so that the drive unit rotates the vacuum chamber via the shaft sealing device to facilitate the formation of a uniform thin film on powder surface. When the pumping stops, the vacuum chamber can be quickly released from the shaft sealing device to improve the process efficiency and convenience of use.
Public/Granted literature
- US20230120393A1 POWDER ATOMIC LAYER DEPOSITION EQUIPMENT WITH QUICK RELEASE FUNCTION Public/Granted day:2023-04-20
Information query
IPC分类: