Invention Grant
- Patent Title: Coated metal alloy substrates and process of production thereof
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Application No.: US17298901Application Date: 2019-06-11
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Publication No.: US11952665B2Publication Date: 2024-04-09
- Inventor: Kuan-Ting Wu , Hsing-Hung Hsieh , Super Liao
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/036491 2019.06.11
- International Announcement: WO2020/251549A 2020.12.17
- Date entered country: 2021-06-01
- Main IPC: C23C28/00
- IPC: C23C28/00 ; C09D5/24 ; C09D5/44 ; C25D13/12
Abstract:
A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.
Public/Granted literature
- US20220112609A1 COATED METAL ALLOY SUBSTRATES AND PROCESS OF PRODUCTION THEREOF Public/Granted day:2022-04-14
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