Invention Grant
- Patent Title: Temperature measuring device, mechanical system, temperature measuring method, and program
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Application No.: US17353073Application Date: 2021-06-21
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Publication No.: US11953384B2Publication Date: 2024-04-09
- Inventor: Masaya Kawano , Masahiro Sugihara , Tadashi Kimura , Shinsuke Sato
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 20168035 2020.10.02
- Main IPC: G01K11/24
- IPC: G01K11/24 ; F16C19/52 ; G01S15/88

Abstract:
A temperature measuring device includes an ultrasonic sensor attached to a rear surface side of the structural body having the multilayer structure, an acquisition unit configured to, through the ultrasonic sensor, acquire a signal of a reflected wave of an ultrasonic wave incident at the internal side of the structural body, an extraction unit configured to extract, from the signal of the reflected wave, a domain including a reflected wave reflected on a surface on the internal side of the structural body, and an identification unit configured to, based on a signal of the reflected wave in the extracted domain, identify the temperature of the surface on the internal side of the structural body.
Public/Granted literature
- US20220107228A1 TEMPERATURE MEASURING DEVICE, MECHANICAL SYSTEM, TEMPERATURE MEASURING METHOD, AND PROGRAM Public/Granted day:2022-04-07
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