Invention Grant
- Patent Title: Test method for tolerance against the hot carrier effect
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Application No.: US17437359Application Date: 2021-05-24
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Publication No.: US11953542B2Publication Date: 2024-04-09
- Inventor: Yifei Pan , Xiaodong Luo
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Cooper Legal Group, LLC
- Priority: CN 2010513669.6 2020.06.08
- International Application: PCT/CN2021/095601 2021.05.24
- International Announcement: WO2021/249176A 2021.12.16
- Date entered country: 2021-09-08
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/27 ; G01R31/28 ; G11C29/02 ; H01L21/66

Abstract:
An embodiment of the present application provides a test method for tolerance against the hot carrier effect, applied to an I/O circuit of a memory, the I/O circuit having an output terminal, comprising: controlling the output terminal to alternately output a first level and a second level, the first level being higher than the second level; obtaining a degradation rate of an output performance parameter of the I/O circuit according to the first level and the second level; and obtaining tolerance of the I/O circuit against the hot carrier effect based on the degradation rate.
Public/Granted literature
- US20230068128A1 TEST METHOD FOR TOLERANCE AGAINST THE HOT CARRIER EFFECT Public/Granted day:2023-03-02
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