Invention Grant
- Patent Title: Method for III-v/silicon hybrid integration
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Application No.: US17858021Application Date: 2022-07-05
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Publication No.: US11953728B2Publication Date: 2024-04-09
- Inventor: Guomin Yu , Mohamad Dernaika , Ludovic Caro , Hua Yang , Aaron John Zilkie
- Applicant: ROCKLEY PHOTONICS LIMITED
- Applicant Address: GB Altrincham
- Assignee: Rockley Photonics Limited
- Current Assignee: Rockley Photonics Limited
- Current Assignee Address: GB Altrincham
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: G02B6/13
- IPC: G02B6/13 ; H01L21/677 ; H01L21/68 ; H01L23/544 ; H01L25/16 ; G02B6/12

Abstract:
A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
Public/Granted literature
- US20220357509A1 METHOD FOR III-V/SILICON HYBRID INTEGRATION Public/Granted day:2022-11-10
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