Invention Grant
- Patent Title: Method for producing multilayer coil component
-
Application No.: US17004334Application Date: 2020-08-27
-
Publication No.: US11955275B2Publication Date: 2024-04-09
- Inventor: Yuya Ishima , Shinichi Kondo , Kosuke Ito , Shingo Hattori , Takashi Suzuki , Hidenobu Umeda
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 19156077 2019.08.28
- Main IPC: H01F41/04
- IPC: H01F41/04 ; H01F27/28 ; H01F41/12

Abstract:
A method for producing a multilayer coil component includes forming, on a main face of a substrate, a first coil conductor extending along the main face having conductivity, forming a second coil conductor and a third coil conductor apart from each other in a direction in which the first coil conductor extends and each extending from the first coil conductor in a first direction orthogonal to the main face, and forming a fourth coil conductor electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending along the main face. The forming the first coil conductor includes forming, on the main face, a first insulator layer provided with a first penetration portion having a shape corresponding to the first coil conductor and exposing a part of the main face, and forming, by plating, the first coil conductor in the first penetration portion.
Public/Granted literature
- US20210065975A1 METHOD FOR PRODUCING MULTILAYER COIL COMPONENT AND MULTILAYER COIL COMPONENT Public/Granted day:2021-03-04
Information query