Invention Grant
- Patent Title: Capacitor component
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Application No.: US17554184Application Date: 2021-12-17
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Publication No.: US11955282B2Publication Date: 2024-04-09
- Inventor: Ha Young Song , Jong Hoon Kim , Min Gon Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210137247 2021.10.15
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/232 ; H01G4/248 ; H01G4/30

Abstract:
A capacitor component includes a body including a dielectric layer and internal electrode layers, with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the internal electrode layers. Each of the internal electrode layers has a capacitance formation portion disposed to overlap an adjacent internal electrode layer, and a lead-out portion extending from the capacitance formation portion and connected to the external electrode. A ratio (H2/H1) of a height difference H2 to a height difference H1 is 0.2 or less, where the height difference H2 is a height difference between the capacitance formation portion and the lead-out portion of a lowermost internal electrode layer the height difference H1 is a height difference between the capacitance formation portion and the lead-out portion of an uppermost internal electrode layer. An average thickness of the dielectric layer is 420 nm or less.
Public/Granted literature
- US20230117761A1 CAPACITOR COMPONENT Public/Granted day:2023-04-20
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