Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17545289Application Date: 2021-12-08
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Publication No.: US11955287B2Publication Date: 2024-04-09
- Inventor: Jang Yeol Lee , Hye Min Bang , Bum Soo Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20200174544 2020.12.14
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G4/248

Abstract:
A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 μm and a maximum thickness of the electrode layer is 5 to 20 μm.
Public/Granted literature
- US20220189700A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2022-06-16
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