Invention Grant
- Patent Title: Electromagnetic relay having embedded contact flush to terminal surface
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Application No.: US17262217Application Date: 2019-02-18
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Publication No.: US11955302B2Publication Date: 2024-04-09
- Inventor: Kohei Otsuka , Ryota Minowa , Hiroyuki Iwasaka , Yasuo Hayashida , Shingo Mori , Naoki Kawaguchi
- Applicant: OMRON CORPORATION
- Applicant Address: JP Kyoto
- Assignee: OMRON CORPORATION
- Current Assignee: OMRON CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: SHINJYU GLOBAL IP
- Priority: JP 18158999 2018.08.28
- International Application: PCT/JP2019/005933 2019.02.18
- International Announcement: WO2020/044607A 2020.03.05
- Date entered country: 2021-01-22
- Main IPC: H01H50/54
- IPC: H01H50/54 ; H01H50/14 ; H01H50/56 ; H01H50/60

Abstract:
An electromagnetic relay includes a fixed terminal, a movable contact piece, a first contact, and a second contact. The fixed terminal includes a first surface. The movable contact piece includes a second surface disposed to face the first surface. The first contact is embedded in one of the fixed terminal or the movable contact piece to be flush with one of the first surface or the second surface. The second contact is disposed on the other of the fixed terminal or the movable contact piece to face the first contact. The second contact protrudes from the other of the first surface or the second surface toward the first contact and include a contact surface smaller than the first contact when viewed from a direction facing the first contact.
Public/Granted literature
- US20210304991A1 ELECTROMAGNETIC RELAY Public/Granted day:2021-09-30
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