Disclosed is a by-product collection apparatus which collects a by-product generated during a manufacturing process of manufacturing a semiconductor or a semiconductor-like product. The apparatus includes: a by-product collection module connected to a pipeline in series and configured to collect a by-product from a by-product gas, wherein the by-product gas flows in the pipeline having an inlet pipe and an outlet pipe provided at upper and lower portions of a first casing; and a cooling water supply module including a cooling water tank and a cooling water pump in a second casing and configured to supply and recover cooling water to and from the by-product collection module through a cooling pipe.