Invention Grant
- Patent Title: Electronic package and heat dissipation structure thereof, comprising bonding pillars
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Application No.: US17549955Application Date: 2021-12-14
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Publication No.: US11955404B2Publication Date: 2024-04-09
- Inventor: Jian-Dih Jeng , Chien-Yu Chen , Wei-Hao Chen
- Applicant: AURAS TECHNOLOGY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/488 ; H01L23/532
Abstract:
An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.
Public/Granted literature
- US20220189849A1 ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF Public/Granted day:2022-06-16
Information query
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