- Patent Title: Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame
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Application No.: US17874898Application Date: 2022-07-27
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Publication No.: US11955410B2Publication Date: 2024-04-09
- Inventor: Yukinori Hatori , Yasushi Araki , Akinobu Inoue , Tsukasa Nakanishi
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Rankin, Hill & Clark LLP
- Priority: JP 19119539 2019.06.27
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/498 ; H01L25/16
Abstract:
An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.
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