Invention Grant
- Patent Title: Compact routing package for high frequency isolation
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Application No.: US17383918Application Date: 2021-07-23
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Publication No.: US11955418B2Publication Date: 2024-04-09
- Inventor: Chenxi Huang , Yung Chen
- Applicant: Cypress Semiconductor Corporation
- Applicant Address: US CA San Jose
- Assignee: Cypress Semiconductor Corporation
- Current Assignee: Cypress Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H01L23/00 ; H01L23/498

Abstract:
Systems, methods, and devices for a ball grid array with non-linear conductive routing are described herein. Such a ball grid array may include a plurality of solder balls that are electrically coupled by a non-linear conductive routing. The non-linear conductive routing may include a plurality of routing sections where each of the plurality of routing sections is disposed at an angle to adjacent routing sections.
Public/Granted literature
- US20230022660A1 COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION Public/Granted day:2023-01-26
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