Invention Grant
- Patent Title: Array substrate and manufacturing method thereof, motherboard and display device
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Application No.: US16965739Application Date: 2019-09-29
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Publication No.: US11955491B2Publication Date: 2024-04-09
- Inventor: Yingmeng Miao , Yinshu Zhang , Zhihua Sun
- Applicant: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Leason Ellis LLP
- International Application: PCT/CN2019/109103 2019.09.29
- International Announcement: WO2021/056549A 2021.04.01
- Date entered country: 2020-07-29
- Main IPC: H01L31/00
- IPC: H01L31/00 ; G02F1/1333 ; G02F1/1343 ; G02F1/1362 ; G02F1/1368 ; H01L27/12 ; G02F1/1345

Abstract:
An array substrate and a manufacturing method thereof, a motherboard and a display device are disclosed. The array substrate has a display region and a non-display region, and includes a base substrate, and a plurality of signal lines and at least one transfer electrode that are on the base substrate. The plurality of signal lines extend from the display region to the non-display region along a first direction, at least one of the plurality of signal lines includes a first trace in the display region and a second trace in the non-display region, the second trace includes at least two sub-traces disconnected from each other, a sub-trace, close to the display region, of the at least two sub-traces of the second trace is directly connected with the first trace, and every two adjacent sub-traces of the second trace are electrically connected with each other.
Public/Granted literature
- US20220384488A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, MOTHERBOARD AND DISPLAY DEVICE Public/Granted day:2022-12-01
Information query
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