Invention Grant
- Patent Title: Image sensing module
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Application No.: US17991788Application Date: 2022-11-21
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Publication No.: US11955495B2Publication Date: 2024-04-09
- Inventor: Shih-Ping Lee , Wen-Hsien Chen
- Applicant: Powerchip Semiconductor Manufacturing Corporation
- Applicant Address: TW Hsinchu
- Assignee: Powerchip Semiconductor Manufacturing Corporation
- Current Assignee: Powerchip Semiconductor Manufacturing Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW 9113796 2020.04.24
- The original application number of the division: US16898412 2020.06.10
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
The present disclosure provides an image sensing module including a main board and an image sensor. The main board has a first surface and a second surface opposite to each other. The image sensor is disposed on the first surface of the main board and includes a plurality of isolation structures and a photoelectric conversion element between the plurality of isolation structures. A first angle is provided between a light incident surface of the photoelectric conversion element and the first surface of the main board, and a second angle is provided between a light beam incident to the light incident surface of the photoelectric conversion element and a normal vector of the light incident surface. The second angle is about equal to the Brewster angle at the interface of the light beam incident to the light incident surface.
Public/Granted literature
- US20230079629A1 IMAGE SENSING MODULE Public/Granted day:2023-03-16
Information query
IPC分类: