Invention Grant
- Patent Title: Routing integrated circuit element
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Application No.: US17553981Application Date: 2021-12-17
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Publication No.: US11955975B2Publication Date: 2024-04-09
- Inventor: Miaobin Gao , Chia-Chi Hu
- Applicant: LeRain Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: LERAIN TECHNOLOGY CO., LTD.
- Current Assignee: LERAIN TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: MUNCY, GEISSLER, OLDS & LOWE, P.C.
- Priority: TW 0113261 2021.04.13
- Main IPC: H03K5/02
- IPC: H03K5/02 ; H01L23/49 ; H04Q11/04

Abstract:
A routing integrated circuit element is disclosed. The routing integrated circuit element is connected between a first and a second electronic module and includes a body, a first, and a second buffer element. A first side of the body is connected to the first electronic module. A second side is connected to the second electronic module and located on a different side from the first side. The distance between the second side and the second electronic module is shorter than the distance between the second side and the first electronic module. The first buffer element transmits an electronic signal from the first side to the second side. The second buffer element transmits the electronic signal from the second side to the first side, wherein the transmission directions of the electronic signals transmitted by the first buffer element and the second buffer element are opposite.
Public/Granted literature
- US20220311427A1 ROUTING INTEGRATED CIRCUIT ELEMENT Public/Granted day:2022-09-29
Information query
IPC分类: