Invention Grant
- Patent Title: Microphone assembly and headlining assembly
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Application No.: US17706236Application Date: 2022-03-28
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Publication No.: US11956580B2Publication Date: 2024-04-09
- Inventor: Shunji Muraoka , Shushin Noda , Yoshifumi Yamanaka , Kouta Onoyama , Daisuke Kitaguchi , Jun Miyajima
- Applicant: HOSIDEN CORPORATION
- Applicant Address: JP Osaka
- Assignee: HOSIDEN CORPORATION
- Current Assignee: HOSIDEN CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP 21063334 2021.04.02
- Main IPC: H04R1/04
- IPC: H04R1/04 ; H04R1/08
Abstract:
A microphone assembly comprises a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and hot melt that is formed to cover the circuit board, the microphone element, and the external connection interface and has a hole formed to expose a part of the back side of the circuit board or the sound receiving part of the microphone element.
Public/Granted literature
- US20220321985A1 MICROPHONE ASSEMBLY AND HEADLINING ASSEMBLY Public/Granted day:2022-10-06
Information query
