Invention Grant
- Patent Title: Case, fan module and fan frame
-
Application No.: US17301575Application Date: 2021-04-08
-
Publication No.: US11956927B2Publication Date: 2024-04-09
- Inventor: Jen-Hsien Lo , Wei-Hao Chen , Sheng-Chieh Tsai
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: WISTRON CORPORATION
- Current Assignee: WISTRON CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW 0101353 2021.01.13
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14

Abstract:
A case is provided, including a shell, a fan frame, and a fan module. The shell is internally provided with a backplane and a motherboard, where the motherboard is connected to the backplane along a first axis, the backplane is connected with a plug connector, the plug connector includes a plug connector body and a plurality of connection terminals, and the connection terminals are located in the plug connector body. The fan frame bears the fan module, and the fan module includes a fan assembly and a matching connector. The matching connector is connected to the fan assembly, and the matching connector is connected to the plug connector along a second axis. The matching connector includes a matching connector body and a plurality of matching terminals, and the matching terminals are located in the matching connector body. The fan frame is fixed in the shell.
Public/Granted literature
- US20220225543A1 CASE, FAN MODULE AND FAN FRAME Public/Granted day:2022-07-14
Information query