Invention Grant
- Patent Title: Shielded cable, shielded cable with circuit board, and multicore cable
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Application No.: US17823204Application Date: 2022-08-30
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Publication No.: US11956936B2Publication Date: 2024-04-09
- Inventor: Yuto Kobayashi
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: IPUSA, PLLC
- Priority: JP 21143454 2021.09.02
- Main IPC: H01B7/08
- IPC: H01B7/08 ; H01B7/00 ; H01B7/02 ; H01B11/06 ; H05K9/00

Abstract:
A shielded cable includes a first insulated wire including a first central conductor, and a first insulating layer provided around the first central conductor, a second insulated wire including a second central conductor, and a second insulating layer provided around the second central conductor, the second insulated wire being disposed parallel to the first insulated wire, a third insulating layer provided around the first insulated wire and the second insulated wire, a shielding layer provided around the third insulating layer, a drain wire in contact with the shielding layer, and a fourth insulating layer provided around the shielding layer and the drain wire.
Public/Granted literature
- US20230066194A1 SHIELDED CABLE, SHIELDED CABLE WITH CIRCUIT BOARD, AND MULTICORE CABLE Public/Granted day:2023-03-02
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