Invention Grant
- Patent Title: Semiconductor device and manufacturing method of semiconductor device
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Application No.: US17372128Application Date: 2021-07-09
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Publication No.: US11956960B2Publication Date: 2024-04-09
- Inventor: Ki Hong Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR 20210008768 2021.01.21
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H10B41/10 ; H10B41/27 ; H10B43/10

Abstract:
A semiconductor device includes a gate stack with conductive layers and insulating layers that are stacked alternately with each other, a first channel pattern passing through the gate stack, a second channel pattern coupled to the first channel pattern, the second channel pattern protruding above a top surface of the gate stack, an insulating core formed in the first channel pattern, the insulating core extending into the second channel pattern, a gate liner with a first portion that surrounds a top surface of the gate stack and a second portion that surrounds a portion of a sidewall of the second channel pattern, and a barrier pattern coupled to the gate liner, the barrier pattern surrounding a remaining portion of the sidewall of the second channel pattern.
Public/Granted literature
- US20220231044A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2022-07-21
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