Invention Grant
- Patent Title: Biostimulator having flexible circuit assembly
-
Application No.: US17565323Application Date: 2021-12-29
-
Publication No.: US11957917B2Publication Date: 2024-04-16
- Inventor: Wade Keller , Thomas B. Eby , Sean McKenna , Brett C. Villavicencio
- Applicant: Pacesetter, Inc.
- Applicant Address: US CA Sylmar
- Assignee: PACESETTER, INC.
- Current Assignee: PACESETTER, INC.
- Current Assignee Address: US CA Sylmar
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Main IPC: A61N1/375
- IPC: A61N1/375

Abstract:
A biostimulator, such as a leadless cardiac pacemaker, having a flexible circuit assembly, is described. The flexible circuit assembly is contained within an electronics compartment between a battery, a housing, and a header assembly of the biostimulator. The flexible circuit assembly includes a flexible substrate that folds into a stacked configuration in which an electrical connector and an electronic component of the flexible circuit assembly are enfolded by the flexible substrate. An aperture is located in a fold region of the flexible substrate to allow a feedthrough pin of the header assembly to pass through the folded structure into electrical contact with the electrical connector. The electronic component can be a processor to control delivery of a pacing impulse through the feedthrough pin to a pacing tip. Other embodiments are also described and claimed.
Public/Granted literature
- US20220118265A1 BIOSTIMULATOR HAVING FLEXIBLE CIRCUIT ASSEMBLY Public/Granted day:2022-04-21
Information query
IPC分类: