Invention Grant
- Patent Title: Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board
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Application No.: US17632038Application Date: 2020-07-30
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Publication No.: US11958951B2Publication Date: 2024-04-16
- Inventor: Masashi Koda , Yuki Kitai , Atsushi Wada , Yasunori Hoshino
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 19145498 2019.08.07
- International Application: PCT/JP2020/029360 2020.07.30
- International Announcement: WO2021/024923A 2021.02.11
- Date entered country: 2022-02-01
- Main IPC: C08L25/08
- IPC: C08L25/08 ; B32B5/02 ; B32B5/26 ; B32B15/14 ; B32B15/20 ; C08F212/08 ; C08J5/18 ; C08J5/24 ; C08K3/36 ; C08L25/10 ; C08L71/12 ; H05K1/03 ; C08L25/16
Abstract:
A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less.
In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
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