Invention Grant
- Patent Title: Thermally conductive material technical field
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Application No.: US17291600Application Date: 2019-11-01
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Publication No.: US11958968B2Publication Date: 2024-04-16
- Inventor: Hiroto Yoshino , Teruaki Yuoka
- Applicant: Kitagawa Industries Co., Ltd.
- Applicant Address: JP Inazawa
- Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Thorpe North & Western
- Priority: JP 18208230 2018.11.05
- International Application: PCT/JP2019/043154 2019.11.01
- International Announcement: WO2020/095858A 2020.05.14
- Date entered country: 2021-05-05
- Main IPC: C08L35/02
- IPC: C08L35/02 ; C08K3/22 ; C08K3/26 ; C08K5/12 ; C08L33/14 ; C09K5/14

Abstract:
A thermally conductive material according to the present technology includes: 100 parts by mass of a crosslinking reaction product of an acrylic polymer (A) including at least two crosslinkable functional groups containing a carbon-carbon unsaturated bond and an acrylic polymer (B) including at least one of the crosslinkable functional groups; from 100 to 200 parts by mass of an acrylic polymer (C) with a viscosity of 650 mPa·s or less; from 150 to 350 parts by mass of a trimellitate ester plasticizer; from 3500 to 7500 parts by mass of a thermally conductive filler with an average particle size ranging from 0.1 μm to 100 μm; and from 50 to 300 parts by mass of a thickener with an average particle size of 50 nm or less.
Public/Granted literature
- US20220017740A1 Thermally Conductive Material Technical Field Public/Granted day:2022-01-20
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