Invention Grant
- Patent Title: Resin composition, kit, method for manufacturing resin composition, method for manufacturing formed article, and formed article
-
Application No.: US17044004Application Date: 2019-05-09
-
Publication No.: US11958973B2Publication Date: 2024-04-16
- Inventor: Fumihito Okamoto
- Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: GLOBAL POLYACETAL CO., LTD.
- Current Assignee: GLOBAL POLYACETAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 18091151 2018.05.10 JP 18244713 2018.12.27
- International Application: PCT/JP2019/018512 2019.05.09
- International Announcement: WO2019/216368A 2019.11.14
- Date entered country: 2020-09-30
- Main IPC: C08L77/06
- IPC: C08L77/06 ; B29C45/00 ; B29C65/16 ; C08K3/38 ; C08K5/00 ; C08K5/5399 ; C08K7/14 ; C08L71/12

Abstract:
To provide a resin composition having large light transmittance and capable of providing a molded article which is highly laser-weldable to an absorbing resin member, as well as a kit, a method for manufacturing the resin composition, a method for manufacturing a formed article, and a formed article. The resin composition contains a polyamide resin, a maleic anhydride-modified polyphenylene ether-based resin, a phosphazene-based flame retardant, a zinc metal oxide, and a light transmitting dye.
Public/Granted literature
Information query