Invention Grant
- Patent Title: Three-dimensional printing
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Application No.: US17051922Application Date: 2019-01-16
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Publication No.: US11958982B2Publication Date: 2024-04-16
- Inventor: James William Stasiak , Garry Hinch , Stanley J. Kozmiski
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/013787 2019.01.16
- International Announcement: WO2020/149840A 2020.07.23
- Date entered country: 2020-10-30
- Main IPC: C09D11/037
- IPC: C09D11/037 ; B29C64/153 ; B29K509/02 ; B33Y10/00 ; B33Y70/00 ; C09D11/102 ; C09D11/106
Abstract:
A materials kit for three-dimensional (3D) printing can include a powder bed material including electroactive polymer particles including electroactive polymer having a melting temperature from about 100° C. to about 250° C. and a fusing agent including a radiation absorber to selectively apply to the powder bed material.
Public/Granted literature
- US20210363364A1 THREE-DIMENSIONAL PRINTING Public/Granted day:2021-11-25
Information query
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