Invention Grant
- Patent Title: Thermistor flow path
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Application No.: US17544215Application Date: 2021-12-07
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Publication No.: US11959481B2Publication Date: 2024-04-16
- Inventor: Ryan David Rosinski , Bradley John Vecellio
- Applicant: GHSP, Inc.
- Applicant Address: US MI Holland
- Assignee: GHSP, Inc.
- Current Assignee: GHSP, Inc.
- Current Assignee Address: US MI Holland
- Agency: Price Heneveld LLP
- Main IPC: F04C2/10
- IPC: F04C2/10 ; F04C15/00 ; F04C29/04 ; F04D13/06 ; F04D29/58

Abstract:
A fluid pump includes a pump element where rotation of the pump element generates suction at the inlet and pressure at the outlet to move fluid through a fluid path. An inlet orifice directs a portion of the fluid through the accessory fluid path that includes a low-restriction return path providing a continuous flow of the fluid through the accessory fluid path and to an outlet orifice. A circuit board housing includes a contoured portion and a PCB with a thermistor in communication with contoured portion. The continuous flow is directed between the contoured portion and the outlet orifice between a rotor and the outer wall. The low-restriction return path maintains a temperature of the continuous flow of the fluid within the contoured portion of the accessory fluid path to be similar to a temperature of the fluid in the fluid path.
Public/Granted literature
- US20220090597A1 THERMISTOR FLOW PATH Public/Granted day:2022-03-24
Information query
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