Invention Grant
- Patent Title: Integrated circuit device
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Application No.: US18144889Application Date: 2023-05-09
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Publication No.: US11961832B2Publication Date: 2024-04-16
- Inventor: Jina Lee , Hyungjoo Youn
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20190157690 2019.11.29
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/02 ; H01L21/8234 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
An integrated circuit device includes a substrate having a first intellectual property (IP) core including a cell region and a first edge dummy region, fin-type active regions protruding from the cell region, dummy fin-type active regions protruding from the first edge dummy region, gate lines extending, over the cell region of the substrate, the gate lines including two adjacent gate lines spaced apart from each other with a first pitch and two adjacent gate lines spaced apart with a second pitch greater than the first pitch, dummy gate lines over the first edge dummy region of the substrate and equally spaced apart from each other with the first pitch.
Public/Granted literature
- US20230290768A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2023-09-14
Information query
IPC分类: