Invention Grant
- Patent Title: Capacitance reduction for back-side power rail device
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Application No.: US17703116Application Date: 2022-03-24
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Publication No.: US11961915B2Publication Date: 2024-04-16
- Inventor: Shi Ning Ju , Chih-Hao Wang , Kuo-Cheng Chiang , Kuan-Lun Cheng , Wen-Ting Lan
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/06

Abstract:
A semiconductor transistor device includes a channel structure, a gate structure, a first source/drain epitaxial structure, a second source/drain epitaxial structure, a gate contact, and a back-side source/drain contact. The gate structure wraps around the channel structure. The first source/drain epitaxial structure and the second source/drain epitaxial structure are disposed on opposite endings of the channel structure. The gate contact is disposed on the gate structure. The back-side source/drain contact is disposed under the first source/drain epitaxial structure. The first source/drain epitaxial structure has a concave bottom surface contacting the back-side source/drain contact.
Public/Granted literature
- US20220216346A1 CAPACITANCE REDUCTION FOR BACK-SIDE POWER RAIL DEVICE Public/Granted day:2022-07-07
Information query
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