Invention Grant
- Patent Title: Electronic device including grip sensing pad
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Application No.: US17679284Application Date: 2022-02-24
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Publication No.: US11962069B2Publication Date: 2024-04-16
- Inventor: Seokwoo Lee , Yeonghun Gu , Youngho Park , Jiwoo Lee , Kio Jung , Ko Choi , Woojin Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, LLC
- Priority: KR 20210028338 2021.03.03
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/38 ; H04M1/02 ; H04M1/72454

Abstract:
An electronic device is disclosed, including: a housing including a nonconductive area, a first printed circuit board (PCB) including a cavity and a fill-cut area, overlapping the nonconductive area, a first antenna module including at least one antenna array disposed in the cavity of the first PCB, a support frame coupled to one surface of the first PCB, supporting the first antenna module, a grip sensing pad surrounding the cavity and overlapping the fill-cut area, and a sensing circuit unit electrically connected to the grip sensing pad, configured to control an output power of the first antenna module based on inputs received via the grip sensing pad.
Public/Granted literature
- US20220285825A1 ELECTRONIC DEVICE INCLUDING GRIP SENSING PAD Public/Granted day:2022-09-08
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