Invention Grant
- Patent Title: Composite substrate
-
Application No.: US17258053Application Date: 2019-07-29
-
Publication No.: US11962284B2Publication Date: 2024-04-16
- Inventor: Koji Hamazono
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: JP 18142596 2018.07.30
- International Application: PCT/JP2019/029644 2019.07.29
- International Announcement: WO2020/027048A 2020.02.06
- Date entered country: 2021-01-05
- Main IPC: H03H9/02
- IPC: H03H9/02

Abstract:
A composite substrate is a plate-shaped body where a first substrate and a second substrate overlap. The composite substrate includes a hole in the first substrate and the second substrate in a thickness direction of the plate-shaped body. A ratio A/B of an average thickness A of the first substrate to an average thickness B of the second substrate is ⅕ or less. An interface between the first substrate and the second substrate on an inner wall of the plate-shaped body that is positioned at the hole includes a part that is covered by a covering layer that contains a component that composes the second substrate.
Public/Granted literature
- US20210167749A1 COMPOSITE SUBSTRATE Public/Granted day:2021-06-03
Information query