Invention Grant
- Patent Title: Efficient wave guide transition between package and PCB using solder wall
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Application No.: US17726426Application Date: 2022-04-21
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Publication No.: US11963291B2Publication Date: 2024-04-16
- Inventor: Leo van Gemert , Michael B. Vincent
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L23/66 ; H01P3/12 ; H05K1/11 ; H05K3/10 ; H05K3/34 ; H05K3/40
Abstract:
A packaging assembly and methodology provide a PCB substrate with one or more waveguide apertures and a conductive pattern which includes a plurality of landing pads that are disposed around peripheral edges of each waveguide aperture and that are connected to one another by trace lines so that, upon attachment and reflow of solder balls to the plurality of landing pads, the solder balls reflow along the trace lines to form a fully closed solder waveguide shielding wall disposed around peripheral edges of the first waveguide aperture.
Public/Granted literature
- US20230345623A1 Efficient Wave Guide Transition Between Package and PCB Using Solder Wall Public/Granted day:2023-10-26
Information query
