- Patent Title: Local stretch package structure and manufacturing method thereof
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Application No.: US17452233Application Date: 2021-10-25
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Publication No.: US11963385B2Publication Date: 2024-04-16
- Inventor: Wen-You Lai , Ping-Hsiang Kao , Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin , Ya-Chu Hsu
- Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
- Applicant Address: CN Sichuan
- Assignee: Interface Technology (ChengDu) Co., Ltd.,Interface Optoelectronics (ShenZhen) Co., Ltd.,General Interface Solution Limited
- Current Assignee: Interface Technology (ChengDu) Co., Ltd.,Interface Optoelectronics (ShenZhen) Co., Ltd.,General Interface Solution Limited
- Current Assignee Address: CN Sichuan; CN Guangdong; TW Miaoli County
- Agency: CKC & Partners Co., LLC
- Priority: CN 2111163501.8 2021.09.30
- Main IPC: H10K50/844
- IPC: H10K50/844 ; H01L25/075 ; H01L27/15 ; H01L33/52 ; H10K59/90 ; H10K71/00 ; H10K77/10 ; H10K102/00

Abstract:
The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.
Public/Granted literature
- US20230099272A1 LOCAL STRETCH PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-03-30
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