Invention Grant
- Patent Title: MRAM cell and MRAM
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Application No.: US17734374Application Date: 2022-05-02
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Publication No.: US11963463B2Publication Date: 2024-04-16
- Inventor: Perng-Fei Yuh , Yih Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- The original application number of the division: US16884297 2020.05.27
- Main IPC: H10N50/80
- IPC: H10N50/80 ; G11C5/02 ; G11C11/16 ; H10B61/00

Abstract:
Magnetic random access memory (MRAM) cells are provided. MRAM cell includes a plurality of stacked magnetic tunnel junction (MTJ) devices coupled in serial, and a transistor. The transistor has a gate coupled to a word line, a first terminal coupled to a bit line through the stacked MTJ devices, and a second terminal coupled to a source line. The stacked MTJ devices have different sizes. Each of the stacked MTJ devices includes a free layer, a pinned layer and a barrier layer between the free layer and the pinned layer. The free layers of two adjacent stacked MTJ devices are in direct contact with each other.
Public/Granted literature
- US20220263011A1 MRAM CELL AND MRAM Public/Granted day:2022-08-18
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