Invention Grant
- Patent Title: Helmet pad
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Application No.: US17285538Application Date: 2019-10-14
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Publication No.: US11963570B2Publication Date: 2024-04-23
- Inventor: Christopher Pietrzak , Marcus Thiel
- Applicant: MIPS AB
- Applicant Address: SE Täby
- Assignee: MIPS AB
- Current Assignee: MIPS AB
- Current Assignee Address: SE Täby
- Agency: Husch Blackwell LLP
- Priority: GB 16832 2018.10.16
- International Application: PCT/EP2019/077797 2019.10.14
- International Announcement: WO2020/078913A 2020.04.23
- Date entered country: 2021-04-15
- Main IPC: A42B3/06
- IPC: A42B3/06 ; A42B3/12

Abstract:
A pad for mounting to a helmet, the pad comprising a support member, a first layer of material arranged to cover a first side of the support member and a second layer of material arranged to cover the first layer of material, wherein a low friction interface is arranged between the first layer of material and the second layer of material to enable sliding of the first layer of material relative to the second layer of material, wherein each layer of material is formed from at least one of a textile, a cloth, a fabric and a felt.
Public/Granted literature
- US20210378345A1 HELMET PAD Public/Granted day:2021-12-09
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