Invention Grant
- Patent Title: Method for low-temperature joining of metal materials, and joint structure
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Application No.: US16080780Application Date: 2017-02-28
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Publication No.: US11964338B2Publication Date: 2024-04-23
- Inventor: Hidetoshi Fujii , Rintaro Ueji , Yoshiaki Morisada
- Applicant: OSAKA UNIVERSITY
- Applicant Address: JP Suita
- Assignee: OSAKA UNIVERSITY
- Current Assignee: OSAKA UNIVERSITY
- Current Assignee Address: JP Suita
- Agency: WHDA, LLP
- Priority: JP 16047806 2016.03.11
- International Application: PCT/JP2017/007677 2017.02.28
- International Announcement: WO2017/154658A 2017.09.14
- Date entered country: 2018-08-29
- Main IPC: B23K20/12
- IPC: B23K20/12 ; B23K20/227 ; B23K20/233 ; B23K103/02 ; B23K103/10

Abstract:
A low-temperature joining method effectively suppresses reductions in the mechanical properties of a junction of various types of high-tensile steel or aluminum, and of a heat-affected zone; and produces a joint structure. A method for joining two metal materials by forming a joint interface in which the two metal materials face each other at a joint portion and plunge a rotation tool caused to rotate at a prescribed speed into the joint, the method for low-temperature joining of metal materials characterized in that the peripheral velocity of the outermost periphery of the rotation tool is set to 51 mm/s or less, whereby the recrystallization temperature inherent to the metal materials is reduced by introducing a large strain to the joint, and recrystallized grains are generated at the joint interface by setting the joining temperature to less than the recrystallization temperature inherent to the metal materials.
Public/Granted literature
- US20210205918A1 METHOD FOR LOW-TEMPERATURE JOINING OF METAL MATERIALS, AND JOINT STRUCTURE Public/Granted day:2021-07-08
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