An injection molding apparatus comprises a support base and a mold carrier removably mounted to the support base. The mold carrier includes a mounting plate with attachment features for engaging the support base. A mold with two mold plates is slidably mounted to the mounting 5 plate. A clamp is operable to move the plates between open and closed positions. In the closed position, the plates abut one another. In the open position, the plates are spaced apart for removing molded articles.