Invention Grant
- Patent Title: Thickness measurement method, thickness measurement device, defect detection method, and defect detection device
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Application No.: US17395867Application Date: 2021-08-06
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Publication No.: US11965735B2Publication Date: 2024-04-23
- Inventor: Yousuke Irie , Hirotsugu Inoue , Koutaro Sakamoto
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Rimon P.C.
- Priority: JP 19019833 2019.02.06
- Main IPC: G01K3/06
- IPC: G01K3/06 ; G01B21/08 ; G01J5/00 ; G01N25/72 ; G01K3/04

Abstract:
A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.
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