Invention Grant
- Patent Title: Cooling assembly for a computer module
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Application No.: US17828074Application Date: 2022-05-31
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Publication No.: US11966265B2Publication Date: 2024-04-23
- Inventor: Joe Robey
- Applicant: EKWB d.o.o
- Applicant Address: SI Komenda
- Assignee: EKWB d.o.o.
- Current Assignee: EKWB d.o.o.
- Current Assignee Address: SI
- Agency: McGarry Bair PC
- Priority: DE 2021114001.3 2021.05.31
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/18 ; H05K7/20 ; H01L23/40

Abstract:
A cooling assembly for a computer module has a cooling device and a mounting device. The mounting device includes a rod shaped fastening element having a male thread and a stop. The fastening element is nonrotatable and movable along its axis with respect to the cooling device. The fastening element is guided through a first hole in the cooling device and a second hole in the computer module, when the cooling device is mounted on the computer module. The stop prevents the fastening element from sliding through the first and second holes. The mounting device also has an elastic element arranged along the axis of the fastening element that presses or pulls the stop away from the computer module. A nut on the mounting device is engageable with the male thread of the fastening element. The stop and the nut are arranged at opposite sides of the computer module.
Public/Granted literature
- US20220382344A1 COOLING ASSEMBLY FOR A COMPUTER MODULE Public/Granted day:2022-12-01
Information query