Invention Grant
- Patent Title: RFID and packaging substrate systems and methods
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Application No.: US17776716Application Date: 2020-11-16
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Publication No.: US11966804B2Publication Date: 2024-04-23
- Inventor: Mark W. Roth
- Applicant: Avery Dennison Retail Information Services LLC
- Applicant Address: US OH Mentor
- Assignee: Avery Dennison Retail Information Services LLC
- Current Assignee: Avery Dennison Retail Information Services LLC
- Current Assignee Address: US OH Mentor
- International Application: PCT/US2020/060792 2020.11.16
- International Announcement: WO2021/097453A 2021.05.20
- Date entered country: 2022-05-13
- Main IPC: G06K19/077
- IPC: G06K19/077

Abstract:
In some embodiments, an RFID device includes an RFID chip, a first antenna coupled to the RFID chip, and a cardboard substrate. The RFID chip may be at least one of attached to the cardboard substrate at a position and embedded within the cardboard substrate at the position. The cardboard substrate may form at least part of a carton blank configured to cover the RFID chip position with at least one layer of cardboard when the carton blank has been assembled into a closed box.
Public/Granted literature
- US20220398425A1 RFID AND PACKAGING SUBSTRATE SYSTEMS AND METHODS Public/Granted day:2022-12-15
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