Invention Grant
- Patent Title: Shared decoder architecture for three-dimensional memory arrays
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Application No.: US17655957Application Date: 2022-03-22
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Publication No.: US11967372B2Publication Date: 2024-04-23
- Inventor: Christophe Vincent Antoine Laurent , Andrea Martinelli , Efrem Bolandrina , Ferdinando Bedeschi
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Holland & Hart LLP
- Main IPC: G11C13/04
- IPC: G11C13/04 ; G11C13/00

Abstract:
Methods, systems, and devices for shared decoder architecture for three-dimensional memory arrays are described. A memory device may include pillars coupled to an access line using two transistors positioned between the pillar and the access line. The gates of the two transistors may be coupled with respective gate lines coupled with circuitry configured to bias the gate line as part of an access operation for a memory cell coupled with the pillar. In some cases, the circuitry may be positioned between tiles of the memory device, at an end of one or more tiles of the memory device, between word line combs of a tile of the memory device, or a combination thereof.
Public/Granted literature
- US20230307041A1 SHARED DECODER ARCHITECTURE FOR THREE-DIMENSIONAL MEMORY ARRAYS Public/Granted day:2023-09-28
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