Invention Grant
- Patent Title: Capacitor component including indium and tin, and method of manufacturing the capacitor component
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Application No.: US17499117Application Date: 2021-10-12
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Publication No.: US11967462B2Publication Date: 2024-04-23
- Inventor: Yun Sung Kang , Su Yeon Lee , Won Jun Na , Byung Kun Kim , Yu Hong Oh , Sun Hwa Kim , Jae Eun Heo , Hoe Chul Jung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210085461 2021.06.30
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/008 ; H01G4/30

Abstract:
A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.
Public/Granted literature
- US20230005664A1 CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-01-05
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