Invention Grant
- Patent Title: Multi-layer ceramic electronic component and circuit board including the same
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Application No.: US17894535Application Date: 2022-08-24
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Publication No.: US11967467B2Publication Date: 2024-04-23
- Inventor: Fumi Mori , Daisuke Iwai , Shinichi Sasaki
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP 21152358 2021.09.17
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/008 ; H01G4/012

Abstract:
A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a plurality of internal electrodes laminated in one axial direction, and an end surface extending along a plane parallel to the axial direction, at least part of the plurality of internal electrode being drawn from the end surface. The external electrode covers the end surface of the ceramic body. In a thermal desorption spectrum of water of the multi-layer ceramic electronic component by thermal desorption spectroscopy, a ratio P1/P2 of a detection intensity P1 of a first peak in a range of 200° C. to 300° C. to a detection intensity P2 of a second peak in a range of 550° C. to 800° C. is equal to or lower than 11.
Public/Granted literature
- US20230086815A1 MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD INCLUDING THE SAME Public/Granted day:2023-03-23
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