Invention Grant
- Patent Title: Forming method of component and plasma processing apparatus
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Application No.: US16646258Application Date: 2019-05-10
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Publication No.: US11967487B2Publication Date: 2024-04-23
- Inventor: Michishige Saito , Kazuya Nagaseki , Shota Kaneko
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP 18094128 2018.05.15
- International Application: PCT/JP2019/018726 2019.05.10
- International Announcement: WO2019/221022A 2019.11.21
- Date entered country: 2020-03-11
- Main IPC: B28B1/00
- IPC: B28B1/00 ; H01J37/32
Abstract:
A forming method of a component for use in a plasma processing apparatus includes irradiating, while supplying a source material of a first ceramic and a source material of a second ceramic different from the first ceramic, an energy beam to the source material of the first ceramic and the source material of the second ceramic.
Public/Granted literature
- US20210366691A1 FORMING METHOD OF COMPONENT AND PLASMA PROCESSING APPARATUS Public/Granted day:2021-11-25
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