- Patent Title: Gate structures in transistor devices and methods of forming same
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Application No.: US17532204Application Date: 2021-11-22
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Publication No.: US11967504B2Publication Date: 2024-04-23
- Inventor: Hsin-Yi Lee , Jia-Ming Lin , Kun-Yu Lee , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A method includes removing a first dummy gate structure to form a recess around a first nanostructure and a second nanostructure; depositing a sacrificial layer in the recess with a flowable chemical vapor deposition (CVD); and patterning the sacrificial layer to leave a portion of the sacrificial layer between the first nanostructure and the second nanostructure. The method further include depositing a first work function metal in first recess; removing the first work function metal and the portion of the sacrificial layer from the recess; depositing a second work function metal in the recess, wherein the second work function metal is of an opposite type than the first work function metal; and depositing a fill metal over the second work function metal in the recess.
Public/Granted literature
- US20220406598A1 GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME Public/Granted day:2022-12-22
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