Invention Grant
- Patent Title: Fan-out package having a main die and a dummy die
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Application No.: US17402734Application Date: 2021-08-16
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Publication No.: US11967563B2Publication Date: 2024-04-23
- Inventor: Yan-Fu Lin , Chen-Hua Yu , Meng-Tsan Lee , Wei-Cheng Wu , Hsien-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/528 ; H01L23/538 ; H01L25/10 ; H01L21/48 ; H01L23/31
Abstract:
A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
Public/Granted literature
- US20210375775A1 Fan-Out Package Having a Main Die and a Dummy Die Public/Granted day:2021-12-02
Information query
IPC分类:
