Invention Grant
- Patent Title: Semiconductor structure, high electron mobility transistor and fabrication method thereof
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Application No.: US17465881Application Date: 2021-09-03
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Publication No.: US11967642B2Publication Date: 2024-04-23
- Inventor: Chih-Yen Chen , Tuan-Wei Wang , Franky Juanda Lumbantoruan , Chun-Yang Chen
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agent Winston Hsu
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/02 ; H01L23/29 ; H01L23/31 ; H01L29/20 ; H01L29/205 ; H01L29/207 ; H01L29/66

Abstract:
A semiconductor structure includes a buffer layer, a channel layer, a barrier layer, a doped compound semiconductor layer, and a composition gradient layer. The buffer layer is disposed on a substrate, the channel layer is disposed on the buffer layer, the barrier layer is disposed on the channel layer, the doped compound semiconductor layer is disposed on the barrier layer, and the composition gradient layer is disposed between the barrier layer and the doped compound semiconductor layer. The barrier layer and the composition gradient layer include a same group III element and a same group V element, and the atomic percentage of the same group III element in the composition gradient layer is gradually increased in the direction from the barrier layer to the doped compound semiconductor layer. A high electron mobility transistor and a fabrication method thereof are also provided.
Public/Granted literature
- US20230070031A1 SEMICONDUCTOR STRUCTURE, HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATION METHOD THEREOF Public/Granted day:2023-03-09
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