Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17479223Application Date: 2021-09-20
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Publication No.: US11967643B2Publication Date: 2024-04-23
- Inventor: Taro Kondo , Shunsuke Fukunaga , Bungo Tanaka , Jun Yasuhara
- Applicant: SANKEN ELECTRIC CO., LTD.
- Applicant Address: JP Niiza
- Assignee: SANKEN ELECTRIC CO., LTD.
- Current Assignee: SANKEN ELECTRIC CO., LTD.
- Current Assignee Address: JP Niiza
- Agency: METROLEX IP LAW GROUP, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40

Abstract:
A semiconductor is disclosed that may include: a first drift region; a base region arranged on the first semiconductor layer; a source region arranged on the base region; a main electrode electrically connected to the source region; and a gate electrode structure that penetrates the source region and base region and reaches the first drift region, wherein the gate electrode structure comprises: a gate electrode; and an insulating material that insulates the gate electrode from the first drift region and the base region; and a field plate structure reaching the first drift region deeper than the gate electrode structure, wherein the field plate structure comprises: a field plate; a resistive part that electrically connects the main electrode to the field plate; and an insulating material that insulates the field plate and the resistive part section from the first drift region and the base region.
Public/Granted literature
- US20230088792A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-03-23
Information query
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