Invention Grant
- Patent Title: Optoelectronic component with conductive, flexible and extendable connecting element and method for producing the same
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Application No.: US17283493Application Date: 2019-09-24
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Publication No.: US11967668B2Publication Date: 2024-04-23
- Inventor: Zeljko Pajkic , David Racz , Luca Haiberger
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: MH2 TECHNOLOGY LAW GROUP LLP
- Priority: DE 2018124751.6 2018.10.08
- International Application: PCT/EP2019/075696 2019.09.24
- International Announcement: WO2020/074252A 2020.04.16
- Date entered country: 2021-04-07
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/00 ; H01L33/52 ; H01L33/62

Abstract:
The invention relates to an optoelectronic component, comprising: at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation during operation; at least one connecting element, which is electrically conductive, flexible and extensible; and a shaped body, which surrounds the at least two optoelectronic semiconductor chips and the at least one connecting element at least in some locations, wherein the optoelectronic semiconductor chips are each arranged on a carrier. The invention further relates to a method for producing an optoelectronic component.
Public/Granted literature
- US20210399180A1 OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT Public/Granted day:2021-12-23
Information query
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