Invention Grant
- Patent Title: Printed circuit board structure including a closed cavity
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Application No.: US17987610Application Date: 2022-11-15
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Publication No.: US11967758B2Publication Date: 2024-04-23
- Inventor: Ki Wook Lee
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US CA Irvine
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/22 ; H01Q1/24 ; H01Q1/36 ; H01Q9/04 ; H05K1/02 ; H05K1/11 ; H05K3/42 ; H05K3/46 ; H05K3/00 ; H05K3/02 ; H05K3/06
Abstract:
A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.
Public/Granted literature
- US20230187820A1 PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY Public/Granted day:2023-06-15
Information query
