Invention Grant
- Patent Title: Packaging structure, network device, and terminal device
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Application No.: US17536332Application Date: 2021-11-29
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Publication No.: US11967778B2Publication Date: 2024-04-23
- Inventor: Heng Qu , Meijuan Fu , Liguo Zhang , Ying Kang
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/24 ; H01Q1/38

Abstract:
This application provides a packaging structure, including an antenna in package and a radio frequency chip that are packaged together, where the antenna in package is fastened on the radio frequency chip. The antenna in package includes a radiator and at least two feeding parts, the at least two feeding parts are electrically connected to the radio frequency chip, the radio frequency chip is configured to receive or transmit a radio frequency signal, and at least one of the at least two feeding parts provides differential feeding for the radiator. This application further provides a network device and a terminal device, to reduce an antenna size and make the antenna easier to mount.
Public/Granted literature
- US20220085509A1 PACKAGING STRUCTURE, NETWORK DEVICE, AND TERMINAL DEVICE Public/Granted day:2022-03-17
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